Precision CNC Dicing / Cutting Saw with Complete Accessories & Laptop - SYJ-400

SYJ-400 is a precise dicing and cutting solution for the R&D Lab in the Materials and Microelectronics research field. It is designed for dicing and cutting almost all kinds of materials up to 4" diameter wafer or 8" L x 4" W x 1" H components. The SYJ-400 saw can be computerized with a position accuracy of 0.01 mm. The sample stage with two angles adjustment allows customers to cut materials at the desired angle with +/- 0.5° tolerance.

Power supply	AC 220V  50Hz
Motor	Brushless magnetic DC motor (110V) with variable speed up to 3,000 rpm Power consumption: 180W
Effective Cutting Range	3 dimension: X-axis: 8" ,   Y-axis: 4",    Z-axis: 4" ( depth)
Moving/Cutting Speed Range	X-axis: 1-50mm/min adjustable Y-axis: 1-50mm/min adjustable Z-axis: 1-20mm/min adjustable
Accuracy	0.0025 mm moving resolution and 0.01 mm position accuracy.
Cutting Blades Kits	One 4" Dia x 0.35 mm thick fully sintered diamond blade   Two pairs of flanges with 62 mm Dia. (for dicing) and 42 mm Dia. (for deep cutting)
Dimension	580mm L x 560mm W x 660mm H