UNIPOL-1502 machine equips with 14 -15" diameter super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 8" diameter (high quality polishing for any size below 6"). It also can be adopted as a standard grinding and polishing machine for preparing metallographic samples.
| Power | AC208-240V (50/60Hz) |
| 12" (300 mm) Diameter Lapping Plate | Flatness < 0.25 micron / inch² |
| Precision Rotating Plate Run-off | < 5 micron |
| Sample Size & Workstation |
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| Adjustable Timer | 0~99 hours |
| Variable Speed | 0 to 125 RPM with digital display |
| Dimensions | 720mm L x 580mm W x 380mm H |
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