UNIPOL-1202 machine is equipped with 12" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" in diameter. It can be used as a standard grinding and polishing machine for preparing metallographic samples as well.
| Power | AC208-240V (50/60Hz) |
| 12" (300 mm) Diameter Lapping Plate | Flatness < 0.25 micron / inch² |
| Precision Rotating Plate Run-off | < 5 micron |
| Two Work Stations with 8° Rocking and adjustable speed | 8" rocking with 0- 9 rocking/minute adjustable |
| Flat Sample Holders | Two Flat Holders: 105 Dia. x 35 T mm, which can carry 2 samples up to 4" diameter |
| Condition Rings | Two condition rings: 120 O.D. x 110 I.D. x 32 T mm, which ensures the polished surface flat |
| Variable Speed | 0 ~ 125 rpm |
| Adjustable Timer | 0 - 99 hours |
| Motor | 300 W high torque DC motor |
| Dimensions | 700 L x 475 W x 300 H (mm) |
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