UNIPOL-802 machine is equipped with 8" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 3" in diameter. It can be used as a standard grinding and polishing machine for preparing metallographic samples as well.
| Power | AC 110V and 208-240V (50/60Hz) |
| Super-Flat 8" Lapping Plate | Flatness < 2.5 micron / inch² |
| Plate Run-off | < 5 micron |
| Two Work Stations Rocking Speed | 8° Rocking with an adjustable speed of 0 - 20 rocking/minute |
| Sample Holders | 80 Dia. x 35 T mm for carrying <3" diameter wafer |
| Two Condition Rings | 95 O.D. x 88 I.D. x 32 T mm |
| Master Plate Speed Range | 0 ~ 250 rpm variable with digital display |
| Operation Timer | 0 - 99 hours |
| Motor | 300 W high torque DC motor |
| Dimensions | 525 L x 350 W x 325 H (mm) |
Enter your email to receive the latest information about Chengyi
Copyright © Henan Chengyi Equipment Science and Technology Co.,Ltd.
All Rights Reserved | Sitemap
